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Bob Moore 9e41d93c97 ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages ... Problem introduced in fix for Package references. Signed-off-by: Bob Moore <robert.moore@intel.com> Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de> Signed-off-by: Len Brown <len.brown@intel.com>		17 years ago
..
Makefile	…
dsfield.c	…
dsinit.c	…
dsmethod.c	ACPICA: Removed extraneous code	17 years ago
dsmthdat.c	…
dsobject.c	ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages	17 years ago
dsopcode.c	…
dsutils.c	ACPICA: changed order of interpretation of operand objects	17 years ago
dswexec.c	ACPICA: changed order of interpretation of operand objects	17 years ago
dswload.c	…
dswscope.c	…
dswstate.c	…