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hardware_samsung/hidl/thermal
History
LuK1337 5408613346
hidl: thermal: Migrate to `tidy_checks_as_errors` 		1 year ago
..
utils hidl: thermal: Use pragma once 3 years ago
Android.bp hidl: thermal: Migrate to `tidy_checks_as_errors` 1 year ago
README.md hidl:thermal: Add README.md and template config 5 years ago
Thermal.cpp hidl: Import pixel thermal HAL 5 years ago
Thermal.h hidl: thermal: Use pragma once 3 years ago
android.hardware.thermal@2.0-service.samsung.rc thermal: Adds missing interface for vendor.thermal-hal-2-0. 4 years ago
android.hardware.thermal@2.0-service.samsung.xml hidl:thermal: Rebrand to Samsung 5 years ago
init.thermal.logging.sh thermal: Add thermal logging daemon 4 years ago
samsung-thermal-logd.rc thermal: Add thermal logging daemon 4 years ago
service.cpp hidl:thermal: Rebrand to Samsung 5 years ago
thermal-helper.cpp thermal: add sensor logging in thermalWatcherCallbackFunc 4 years ago
thermal-helper.h hidl: thermal: Use pragma once 3 years ago
thermal_info_config_template.json hidl:thermal: Add README.md and template config 5 years ago

README.md

Samsung HIDL thermal HAL

The HAL uses the standard linux thermal interface and can be configured by adding thermal zones and cooling devices present on the device in a thermal_info_config.json file.

To probe them, just connect the phone via ADB and check the nodes available under /sys/class/thermal/. The name of each thermal zone and cooling device can be found in the type node, e.g.

/sys/class/thermal/thermal_zone0/type
/sys/class/thermal/cooling_device0/type

For each thermal device it is possible to configure a "Sensor" node in thermal_info_config.json, and setting up to 7 throttling levels, from NONE to SHUTDOWN. At each severity level, the hal send signals to throttle the device to the framework, according to : https://source.android.com/devices/architecture/hidl/thermal-mitigation In order to set temperature curve for the desired component you can took as a refererence the kernel trip points temperatures, for the specific devices, available in the thermal_zoneX sysfs. Each sensor can be classified as CPU, GPU, USB_PORT or BATTERY type. If you have a thermal monitor which does not belong to any of this categories you can classify it as UNKNOWN. You can specify hysteresis as well as if the interface should be monitored. If you monitor the interface, the HAL takes action when the specifc treshold is passed. You should not enable monitor if your kernel already implement thermal mitigatoin for the specified component. Since each device reports temperatures multiplied by different factor of 10, you should set the Multipler field such as /sys/class/thermal/thermal_zoneX/temp is reported in Celusis degrees (e.g. 25100 reported by sysfs, multiplied by 0.001 is 25.1).

The same can be said for cooling devices. For each cooling devices can be created a CoolingDevices node in thermal_info_config.json. Each cooling interface can be classified as CPU, GPU or BATTERY type. If you have a cooling device which does not belong to any of this categories you can classify it as COMPONENT. The thermal_info_config.json should be copied under /vendor/etc.

For more details, refer on the sample config schema.